Nts'etsopele ea mahlale a macha indastering ea optoelectronic e khothalelitse lits'ebetso tse ncha tsa mahlale a optoelectronic masimong a likoloi tse bohlale, ts'ireletso e bohlale, AR/VR, liroboto le matlo a bohlale.
1. Kakaretso ea ketane ea indasteri ea ho lemoha pono ea 3D.
Indasteri ea ho lemoha pono ea 3D ke indasteri e ntseng e hola e thehileng ketane ea indasteri e kenyeletsang li-terminal tsa holimo, bohareng, tlase le tsa ts'ebeliso kamora lilemo tse ka bang leshome tsa lipatlisiso tse tsoelang pele, lipatlisiso le nts'etsopele le ts'ebeliso.
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Tlhahlobo ea sebopeho sa ketane ea indasteri ea pono ea pono ea 3D
Karolo e ka holimo ea ketane ea indasteri ke bafepedi kapa bahlahisi ba fanang ka mefuta e fapaneng ea lisebelisoa tsa sensor ea pono ea 3D. Sensor ea pono ea 3D e entsoe haholo-holo ka chip ea enjene e tebileng, mojule oa litšoantšo tsa optical, mojule oa projekto ea laser, le lisebelisoa tse ling tsa elektroniki le likarolo tsa sebopeho. Har'a tsona, likarolo tsa mantlha tsa mojule oa litšoantšo tsa optical li kenyelletsa likarolo tsa mantlha tse kang li-chip tse utloang leseli, lilense tsa litšoantšo le li-filter; mojule oa projekto ea laser o kenyelletsa likarolo tsa mantlha tse kang li-transmitter tsa laser, likarolo tsa optical tse hasanyang, le lilense tsa projekto. Bafepedi ba li-chip tse utloang ba kenyelletsa Sony, Samsung, likarolo tsa Weir, Siteway, jj.; bafepedi ba filthara ba kenyelletsa Viavi, Wufang Optoelectronics, jj., bafepedi ba lense ea optical ba kenyelletsa Largan, Yujing Optoelectronics, Xinxu Optics, jj.; Bafepedi ba laser emission ba lisebelisoa tsa optical ba kenyelletsa Lumentum, Finisar, AMS, jj., 'me bafepedi ba likarolo tsa optical tse hasanyang ba kenyelletsa CDA, AMS, Yuguang Technology, jj.
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Karolo e bohareng ea ketane ea indasteri ke mofani oa tharollo ea pono ea 3D. Likhamphani tse emelang tse kang Apple, Microsoft, Intel, Huawei, Obi Zhongguang, jj.
Karolo e ka tlase ea ketane ea indasteri e nts'etsapele haholo-holo merero ea algorithm ea ts'ebeliso ea li-algorithms tse fapaneng tsa ts'ebeliso ho latela maemo a fapaneng a ts'ebeliso ea terminal. Hona joale, li-algorithms tse nang le lits'ebetso tse itseng tsa khoebo li kenyelletsa: temoho ea sefahleho, algorithm ea ho lemoha bophelo, tekanyo ea 3D, algorithm ea ho aha bocha ea 3D, karohano ea setšoantšo, algorithm ea ntlafatso ea setšoantšo, algorithm ea VSLAM, skeleton, temoho ea boitšisinyo, algorithm ea tlhahlobo ea boitšoaro, AR e immersive, li-algorithms tsa 'nete tsa sebele, jj. Ka ntlafatso ea maemo a ts'ebeliso ea pono ea 3D, li-algorithms tse ling tsa ts'ebeliso li tla rekisoa.
2. Tlhahlobo ea boholo ba 'maraka
Ka ntlafatso e butle-butle ea litšoantšo tsa 2D ho ea ponong ea 3D, 'maraka oa pono ea 3D o se o le mohatong oa pele oa kholo e potlakileng ea sekala. Ka 2019, 'maraka oa lefats'e oa pono ea 3D o bohlokoa ba lidolara tse limilione tse likete tse 5 tsa Amerika, 'me sekala sa' maraka se tla hola ka potlako. Ho lebelletsoe hore o tla fihla ho lidolara tse limilione tse likete tse 15 tsa Amerika ka 2025, ka sekhahla sa kholo se kopaneng sa hoo e ka bang 20% ho tloha ka 2019 ho isa ho 2025. Har'a tsona, masimo a ts'ebeliso a ikarabellang bakeng sa karolo e phahameng haholo le e holang ka potlako ke lisebelisoa tsa elektroniki le likoloi tsa bareki. Ts'ebeliso ea pono ea 3D lefapheng la likoloi le eona e ntlafatsoa le ho ntlafatsoa khafetsa, 'me ts'ebeliso ea eona ho khanna ka boiketsetso e ntse e hola butle-butle. Ka bokhoni bo boholo ba 'maraka ba indasteri ea likoloi, indasteri ea pono ea 3D e tla tlisa leqhubu le lecha la kholo e potlakileng ka nako eo.
3. Tlhahlobo ea nts'etsopele ea ts'ebeliso ea karolo ea 'maraka ea indasteri ea pono ea 3D
Kamora lilemo tsa nts'etsopele, theknoloji le lihlahisoa tsa pono ea 3D li khothalelitsoe le ho sebelisoa masimong a mangata a kang lisebelisoa tsa elektroniki tsa bareki, biometrics, AIoT, tekanyo ea mahlakore a mararo ea indasteri, le likoloi tse khannang ka bohona, 'me li bapala karolo ea bohlokoa moruong oa naha.
(1) Tšebeliso lefapheng la lisebelisoa tsa elektroniki tsa bareki
Lifono tse bohlale ke e 'ngoe ea maemo a maholohali a ts'ebeliso ea theknoloji ea pono ea 3D lefapheng la lisebelisoa tsa elektroniki tsa bareki. Ka nts'etsopele e tsoelang pele ea theknoloji ea pono ea 3D, ts'ebeliso ea eona lefapheng la lisebelisoa tsa elektroniki tsa bareki e ntse e hola khafetsa. Ntle le lifono tse bohlale, e boetse e sebelisoa haholo lisebelisoa tse fapaneng tsa terminal joalo ka lik'homphieutha le li-TV.
Thomello ea li-PC lefatšeng ka bophara (ntle le matlapa) e fihlile ho li-unit tse limilione tse 300 ka 2020, e leng keketseho ea hoo e ka bang 13.1% ho feta 2019; thomello ea li-tablet lefatšeng ka bophara e fihlile ho li-unit tse limilione tse 160 ka 2020, e leng keketseho ea hoo e ka bang 13.6% ho feta 2019; 2020 Thomello ea lefats'e ea litsamaiso tsa boithabiso ba video tse bohlale (ho kenyeletsoa li-TV, li-consoles tsa lipapali, jj.) e ne e le li-unit tse limilione tse 296, tse lebelletsoeng ho hola butle-butle nakong e tlang. Theknoloji ea pono ea 3D e tlisa boiphihlelo bo betere ba mosebelisi ho basebelisi masimong a fapaneng a lisebelisoa tsa elektroniki tsa bareki, 'me e na le sebaka se seholo sa ho kenella' marakeng nakong e tlang.
Ka tšehetso ea maano a naha, ho lebeletsoe hore lits'ebetso tse fapaneng tsa theknoloji ea pono ea 3D lefapheng la lisebelisoa tsa elektroniki tsa bareki li tla tsoela pele ho hola, 'me sekhahla se nepahetseng sa ho kenella' marakeng se tla eketseha le ho feta.
(2) Tšebeliso lefapheng la biometrics.
Ka ho hola ha tefello ea mehala ea thekeng le theknoloji ea pono ea 3D, ho lebelletsoe hore maemo a mangata a tefello a kantle ho inthanete a tla sebelisa tefello ea sefahleho, ho kenyeletsoa mabenkele a boiketlo, maemo a ho itšebeletsa a sa etsoeng ke motho (joalo ka mechini ea ho rekisa, likhabote tse bohlale tsa express) le maemo a mang a hlahang a Tefo (joalo ka mechini ea ATM/automated teller, lipetlele, likolo, jj.) a tla tsoela pele ho tsamaisa nts'etsopele e potlakileng ea indasteri ea ho lemoha pono ea 3D.
Tefo ea ho skena sefahlehong e tla kenella butle-butle libakeng tsohle tsa tefo ea inthanete ho latela boiketlo le ts'ireletso ea eona e ntle, 'me e tla ba le sebaka se seholo sa' maraka nakong e tlang.
(3) Kopo tšimong ea AIoT
Tšebeliso ea theknoloji ea pono ea 3D lefapheng la AIoT e kenyelletsa ho skena sebaka sa 3D, liroboto tsa litšebeletso, tšebelisano ea AR, ho skena batho/liphoofolo, temo e bohlale le tlhokomelo ea liphoofolo, lipalangoang tse bohlale, temoho ea boitšoaro ba ts'ireletso, boikoetliso ba 'mele, jj.
Pono ea pono ea 3D e ka boela ea sebelisoa bakeng sa tlhahlobo ea lipapali ka ho lemoha le ho beha 'mele le lintho tse tsamaeang ka potlako. Mohlala, liroboto tsa tenese ea tafole li sebelisa li-algorithms tsa ho latela lintho tse nyane tse lebelo le ho hlahisa litsela tsa tenese ea tafole ka 3D ho phethahatsa tšebeletso le kananelo ka boiketsetso. Ho latela, ho ahlola le ho fumana lintlha, jj.
Ka bokhutšoanyane, theknoloji ea pono ea 3D e na le maemo a mangata a ka sebelisoang a ka hlahlojoang tšimong ea AIoT, e tla rala motheo oa nts'etsopele ea tlhoko ea 'maraka ea nako e telele ea indasteri.
Nako ea poso: Pherekhong-29-2022
